Senior Failure Analysis Engineer

Responsibilities

• Develop Advanced FA Techniques & Methodologies
• Pioneer Novel Methods
• Design and implement cutting-edge methodologies to drive successful root-cause investigations on leading-edge silicon, advanced heterogeneous packaging technologies, and complex integrated systems.
• Precision De-processing: Perform mechanical cross-sectioning, parallel de-layering, and advanced chemical/plasma de-processing of integrated circuit (IC) devices across die, package, component, and board levels.
• Nanoscale Analysis: Apply advanced Focused Ion Beam (FIB) sample preparation and analysis techniques to enable high-resolution electrical and physical diagnostics of IC chips.
• Innovate Characterization Platforms
• Develop novel characterization techniques and specialized analysis platforms tailored for emerging chip structures with advanced silicon architectures and complex packaging schemes.
• Optimize Workflows
• Design and implement robust failure analysis (FA) workflows to improve laboratory efficiency and guarantee accurate, reproducible root-cause determination.
• Conduct In-Depth FA Investigations

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