Senior Package Layout Engineer

NVIDIA

Taiwan, Hsinchu · On-site · relocationSalary not disclosedfull-timeNVIDIA Careers (offices abroad)

NVIDIA IC Packaging design team is looking for a Senior IC Packaging Design Engineer to join our package team and focus on delivering and designing state of the art high-speed Interconnect systems for Supercomputers and Datacenters. This position will collaborate with Technical Package Lead and cooperation with different design teams and development of complex, detailed layout of IC substrates for NVIDIA products.

Responsibilities

As part of a Package Layout team, you will collaborate to implement high speed and PDN design for ASIC packages.
Develop symbols, pad stack and perform substrate package routing, placement, stack-up, reference plane, power distribution using APD or SiP tools.
Optimize package pin out incorporating system level trade-offs of pins assignment.
Develop methodologies to improve layout environment, productivity, reliability, and schedule considerations.
In close co-operation with the SI/PI/HW design teams and product teams
Planning, ensuring stakeholder management and leading projects from start to finish
What we need to see
B.Sc. Electrical Engineering or any equivalent experience.
Minimum of 5+ years hand-on in Package or/and PCB Layout; including high speed design signal integrity practice; PDN designing and planning
Experience in substrate layout of wire bond and flip chip packages, preferred

Languages

Work format: On-site
Seniority: Senior
Posted: 5 Sept 2025
Last verified: In the last 5 days

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