Senior Packaging Technical Engineer - Hardware

Responsibilities

• Your responsibilities include defining the chip pad ring, substrate interconnect scheme, and lead the package layout design process.
• We collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers.
• Work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package!
• Communicate effectively with various teams throughout the company
• What we need to see
• BSEE or equivalent experience.
• Minimum of 8+ years in board/system design. Experience with package design is preferred.
• Good understanding of transmission line theory, power delivery and signal integrity is desired.
• Strong programming and scripting skills in Perl, Python, Tcl desired, Cadence Skill and EXCEL familiarity are helpful.
• Enthusiastic and able to work with a minimum of supervision.

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