Senior Signal Integrity Engineer - Cryogenic Interconnects

Responsibilities

• Develop accurate 3D EM models for PCB and interconnect structures using tools such as HFSS
• Simulate multi-layer PCB designs under cryogenic conditions
• Define high-speed constraints, SI specifications, and design guidelines across RF, materials, and thermal domains
• Work on next-generation cryogenic interconnect solutions for ultra-high-speed communication
• Collaborate closely with SI, materials, mixed-signal, and system teams to drive end-to-end interconnect performance
• Perform lab characterization and validation using network analyzers and other measurement tools
• Correlate simulation results with hardware measurements to improve modeling accuracy
• Contribute to system-level understanding of interconnect behavior across PCB, package, and system domains
• What we need to see
• MS/PhD in Electrical Engineering or equivalent experience

Languages