Senior Director, Board Product Development Engineering

Responsibilities

• Design, implement, and institutionalize the integration readiness process for all next-generation datacenter board products — owning manufacturing and test readiness end to end so build starts land on schedule and at target yield.
• Guide the functional teams in developing cross-boundary techniques before silicon and stackup freeze occurs. Focus on warpage-tolerant DFM and reflow for next-gen BGA pitch.
• Manage impedance and CTE control for high-speed stackups. Lock pad-map and fab methods at an early stage.
• Build, lead, and develop a global Board PDE organization across three technical pillars — PCB & Fab, SMT/PCBA, and High-Speed Connector & Signal Integrity.
• Set up integration oversight throughout the chip-to-board stack. Define entry and exit requirements at each domain boundary.
• Lead the gates to confirm one qualified domain is ready to pass to the next.
• Collaborate with Operations Test Engineering and Signal Integrity to establish test coverage and manufacturing test flow requirements, applying that thoroughness to the tester and diagnostic boards.
• Take charge of reliability and yield performance throughout the stack. Investigate excursions to identify root causes. Address DFx and alternate-component gaps with the factory planning and design teams.
• Support manufacturing partners (CM/ODM/OSAT, substrate, and PCB fab) in producing world-class datacenter products. Serve as the senior chip-to-board representative across NVIDIA's Operations, Engineering, and Executive teams.
• What we need to see

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