Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging

Responsibilities

• Power, Thermal & Packaging Limits Analysis: Gather and analyze the hard constraints of packaging, power delivery, and thermal dissipation against roadmap demands, predicting when those constraints will reduce competitiveness and acting before they do.
• Cross-Domain Solution Development
• Develop solutions that span silicon features, packaging innovation, firmware and hardware co-design, and DFX updates, ensuring future products are not only performant but testable to the highest quality and reliability standards.
• Packaging Technology Evaluation: Assess emerging packaging technologies for their voltage/frequency, noise, reliability, and testability implications, determining which are worth adopting and the trade-offs each choice entails across the full system.
• System-Manufacturing Co-Design
• Drive improvements in product performance, performance-per-watt, and provisioning efficiency through system-manufacturing co-design, with the scope to follow the work wherever the highest-impact opportunities lead, whether that's power, thermal, or adjacent domains.
• What we need to see
• BS/MS/PhD in EE, Physics, or CE (or equivalent experience).
• 12+ years relevant experience
• Deep understanding of power delivery, thermal dissipation, and current density in high-performance GPU/CPU systems

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