Senior Package Modeling Engineer

Responsibilities

• Conduct Finite Element Analysis (FEA) to assess stress, warpage, and thermo-mechanical behavior throughout advanced semiconductor packaging platforms.
• Contribute to packaging technology direction and long‐term roadmaps by evaluating new materials, interconnect concepts, and process options with a focus on structural robustness and reliability.
• Analyze material properties and their impact on package reliability.
• Establish modeling approaches and assumptions, interpret simulation results, and provide practical mentorship that influences package build, material selection, and manufacturing processes.
• Collaborate with cross-functional teams to ensure robust package builds.
• Document modeling methodologies and present findings to collaborators.
• What We Need To See
• MS or PhD or equivalent experience in Mechanical Engineering, Materials Science, or related field.
• 5+ years of FEA modeling/simulation experience.
• Strong expertise in FEA tools (ANSYS, Abaqus, COMSOL, or equivalent).

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