3D Chiplet Engineer

Responsibilities

• Integration Architecture & Process Definition
• Develop and define architectures for 2.5D/3D stacking of VIM chiplets with compute chiplets.
• Collaborate with design and technology teams to develop interconnect solutions that ensure high bandwidth and low latency.
• Define clearly the impact of the chiplet physical design chiplets (through-silicon vias, micro-bumps, hybrid bonds, redistribution layers, and chiplet interfaces, ...)
• define fabrication flows and design rules with foundries, packaging partners, and internal physical design teams
• Performance Analysis & Simulation
• Conduct early multi-physics simulations (thermal, electrical, mechanical) to analyze and optimize the performance and reliability of integrated systems.
• drive external partners for final package design
• Collaboration & Communication:Partner closely with design, process engineering, metrology, and system architecture teams.
• Participate in conferences, standardization bodies and industry events to promote or lead discussions about the future of chiplet integration.

Languages