Principal Power and Thermal Architect

Responsibilities

• Architect next-generation system, platform, and datacenter-level power and thermal co-design solutions. Scan internal research, academia, standards bodies, and silicon, memory, packaging, and platform partners for what is emerging.
• Build the product differentiation case for each candidate idea, performance, power, reliability, schedule, cost, and brainstorm what is worth pursuing.
• Lead end-to-end co-design from concept to product.
• Drive alignment across architecture, VLSI, software, platform, packaging, and operations teams to land selected technologies in production.
• Shape innovation across workload-aware power and thermal controls, closed-loop platform telemetry, datacenter-class power compliance, platform-scale energy buffering, advanced cooling intercepts, and emerging memory co-design.
• Maintain a living intercept pipeline. Track candidates, productization status, decision gates, and product axes. Brief SCG and broader NVIDIA leadership on what is next.
• Collaborate with system architects, platform and software engineers, manufacturing partners, and external researchers to bring next-generation products to market.
• What we need to see
• BS, MS, or PhD in Electrical Engineering, Computer Engineering, Computer Science, or equivalent experience.
• 15+ years in system-level power, thermal, or related architecture, with deep expertise in at least one of: system power management, system thermal architecture, platform energy architecture, workload-aware power and thermal controls, or memory co-design.

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