Senior Hardware Technical Lead, Interconnect Systems

Responsibilities

• Drive the full program lifecycle of advanced CPO and interconnect test solutions — from requirements through architecture, design, bring-up, characterization, qualification, and release to HVM — while continuously evaluating new technologies and methodologies.
• Act as the technical focal point across parallel workstreams including Board
• Design, Silicon Photonics, Opto-Mechanics, Thermal, FW/SW, DFT, Process Engineering, Manufacturing, and Quality — building integration plans and communicating status, priorities, risks, and dependencies to leadership.
• Mentor engineers, conduct design reviews, and deliver constructive feedback to elevate team capabilities and foster a culture of engineering excellence; influence, lead, and align multi-site, multi-disciplinary teams toward common goals.
• Consolidate requirements from internal stakeholders (Systems Engineering, Software, Marketing, Architecture, Production) into a comprehensive plan of record; coordinate resource allocation and team assignments in partnership with engineering management.
• Define and execute the validation and coverage strategy from die to system level — develop characterization plans, test methodologies, automation frameworks, and data analysis pipelines to validate product performance across environmental conditions (temperature, voltage, process corners).
• Perform hands-on electrical and optical debug, failure analysis, and failure segmentation using advanced lab equipment (oscilloscopes, spectrum analyzers, OPMs, BER testers, source meters); drive root-cause analysis of complex issues spanning electrical, optical, mechanical, thermal, and firmware domains.
• Develop scripting and automation solutions (Python) for test automation, data collection, hardware control (I2C, SPI), and production process optimization; own electrical specifications, peripheral equipment selection, and DFM/DFT guidelines.
• Partner with manufacturing and production engineering teams to build robust test solutions for mass production, improve yield and test coverage, and lead innovations that reduce test time and cost.
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